Chipbond Technology Corporation logo

Chipbond Technology Corporation

TPEx:6147.TWO

Overview | Financials
Company Name Chipbond Technology Corporation
Symbol 6147.TWO
Currency TWD
Price 69.9
Market Cap 52,052,850,163
Dividend Yield 7%
52-week-range 57.2 - 72.5
Industry Semiconductors
Sector Technology
CEO Mr. Huo-Wen Gao
Website https://www.chipbond.com.tw

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About Chipbond Technology Corporation

Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold,

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Financials

Numbers are in millions USD

Numbers are in millions USD