![Chipbond Technology Corporation logo](/logos/6147.TWO.webp)
Chipbond Technology Corporation
TPEx:6147.TWO
Overview | Financials
Company Name | Chipbond Technology Corporation |
Symbol | 6147.TWO |
Currency | TWD |
Price | 69.9 |
Market Cap | 52,052,850,163 |
Dividend Yield | 7% |
52-week-range | 57.2 - 72.5 |
Industry | Semiconductors |
Sector | Technology |
CEO | Mr. Huo-Wen Gao |
Website | https://www.chipbond.com.tw |
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About Chipbond Technology Corporation
Chipbond Technology Corporation, together with its subsidiaries, engages in the research, development, manufacture, and sale of metal, gold, and tin-lead bumps; flip chips; and tape and reel bonding and packaging substrates in Taiwan, the United States, and internationally. The company offers turnkey services, which comprise bumping manufacturing services, including gold,
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Numbers are in millions USD
Numbers are in millions USD